Phone Cooling Plate & Heatsink Pad, Heat Pipe Heat Dissipation Plate for Comprehensive Cooling Across Smartphones and Computers Phone Coolers
Product details
| Management number | 237043465 | Release Date | 2026/07/10 | List Price | US$6.40 | Model Number | 237043465 | ||
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| Category | |||||||||
Heat Pipe Heat Dissipation Plate for Comprehensive Cooling Across Smartphones and Computers Features: Enhances your device cooling efficiency with builts in heat pipes, superior thermal management for during highly demand tasks Featuring 1.4mm aluminum alloy and copper construction with attachment and thermal conductives double sided tape, this heat pipe ensures easy installation and secure adhesion without adding bulk for enthusiasts and everyday users seeking thermal controls, it simplifies upgrades to cooling systems for those prioritizing durability and hasslefree maintenance Ideal for pairing with coolers to expand heat dissipation on smartphones during gaming or heavy usage, it fit directly on backs or requires film removal for nonmagnetic devices, avoiding case interferences Offering broad compatibility with mainstream components and copper materials, this cooling accessory provides long heat pipe for consistent thermal regulation in various setups Specifications: Materials: copper Size: 150x70x5mm Package Includes: 1PC Heat Pipe Plate Note: Please allow 0-1cm error due to manual measurement make sure you not mind before bid Due to the differences between different monitors, the Pictures may not reflect the actual of the item
- Featuring 1.4mm aluminum alloy and copper construction with attachment and thermal conductives double sided tape, this heat pipe ensures easy installation and secure adhesion without adding bulk
- Enhances your device cooling efficiency with builts in heat pipes, superior thermal management for during highly demand tasks
- Offering broad compatibility with mainstream components and copper materials, this cooling accessory provides long heat pipe for consistent thermal regulation in various setups
- for enthusiasts and everyday users seeking thermal controls, it simplifies upgrades to cooling systems for those prioritizing durability and hasslefree maintenance
- Ideal for pairing with coolers to expand heat dissipation on smartphones during gaming or heavy usage, it fit directly on backs or requires film removal for nonmagnetic devices, avoiding case interferences
| ASIN | B0GQ2ZRDGP |
|---|---|
| Model | STDEV |
| Brand Name | STDEV |
| Unit Count | 1.0 Count |
| Part Number | STDEV |
| Manufacturer | STDEV |
| Included Components | as described |
| Cooler Heatsink Material | Aluminum and Copper |
| Item Dimensions L x W x H | 5.91"L x 2.76"W x 0.2"H |
| Cooler Heatsink Compatibility | Broad compatibility with mainstream components and copper materials |
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